Adhesives

HIGHEST STRENGTH FOR PUR REPLACEMENTS

Products | Adhesives (higher modulus)

In the early days of silane-modified polymers, making a high modulus flexible adhesive for structural applications was only possible starting from a polyurethane polymer.


TEGOPAC® Bond 170

TEGOPAC® Bond 170 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 170 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.

Product Datasheet (EN)