HIGH ELASTICITY AND STABILITY FOR LONG LASTING SOLUTIONS
A low modulus sealant is defined as an elastomeric material with a modulus at 100 % elongation of up to 0.4 MPa. This property can be obtained simply by the addition of an appropriate plasticizer. However, being non-reactive and not chemically anchored into the formulation, the plasticizer product can in turn have negative effects on properties like the elastic recovery.
TEGOPAC® Bond 170
TEGOPAC® Bond 170 is a silylated polymer that is used for production of neutral curing adhesives and sealants. The polymer is based on a unique polymer technology with lateral crosslinking groups. TEGOPAC® Bond 170 shows excellent through cure properties, improved water & thermal resistance and excellent elastic recovery properties. The low polymer viscosity allows quick & easy handling.Product Datasheet (EN)