Sticks perfectly to various substrates at highest curing rates
Sealing adhesives (medium modulus)
Sealing adhesives need to cover a vast range of technical properties. It is important for the formulations to be able to adhere on various metals, concrete, minerals, and plastics.
Medium modulus sealing adhesives additionally require a certain strength whilst keeping a reasonable elasticity. Outstanding through cure, excellent ageing stability and a broad bonding range are mandatory properties for such products. High through curing rates are important to ensure reliable bonds especially for bulky joints.
Ageing is another big issue in a lot of applications and each of them has different requirements. Therefore a lot of testing is done on sealing adhesives ranging from exposure to UV-light to different climatic testing.
The applications for medium modulus sealing adhesives are numerous e.g. building & construction, transportation, industrial assembly, and flooring.
Suitable products for applications of medium modulus sealants can be found in the product listing.
- Polymer ST 77
Polymer ST 77 is free of phthalates and is highly recommended for demanding applications where a balanced stress-strain behavior is re-quired as in transport and assembly applica-tions. Examples for the use of Polymer ST 77-based formulations are the assembly of superstructural parts, bumpers, etc. Mechanical fastening is often avoided as it could cause damage to the materials used. In addition, it could negatively affect the design.
- TEGOPAC® Bond 150
TEGOPAC® Bond 150 is recommended for usage as a binder in assembly adhesives and sealant formulations. The combination of outstanding through-cure and excellent elastic recovery properties allows formulations with TEGOPAC® Bond 150 to be used in a number of demanding applications, e.g. in construction of sandwich elements, for flexible bonding in transport applications or for high quality expansion joints.